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Aluminum Nitride AlN Nanopowder / Nanoparticles (AlN, 99.5%, 65-75 nm, Hexagonal)

$138/5g with 1-2wt% PVP Coated
$138/5g with 1-2wt% Silicon Oil Coated
with 1-2wt% Oleic Acid Coated
$138/5g with 1-2wt% Stearic Acid Coated
$138/5g with 1-2wt% Silane Coated
$138/5g with 1-2wt% Mineral Oil Coated
$138/5g with 1-2wt% Amino Acid Coated

$680/30ml-20wt% fully dispersed in Ethanol 
80/30ml-20wt% fully dispersed in NMP
80/30ml-20wt% fully dispersed in Toluene
80/30ml-20wt% fully dispersed in Ethylene Glycol (EG)
$680/30ml-20wt% fully dispersed in Acetone
80/30ml-20wt% fully dispersed in Isopropanol (IPA) / 2-Propanol
80/30ml-20wt% fully dispersed in Silicone Oil (SO)
80/30ml-20wt% fully dispersed in Dimethyl Sulfoxide (DMSO)
80/30ml-20wt% fully dispersed in Mineral Oil (MO)
80/30ml-20wt% fully dispersed in Tetrahydrofuran (THF)
$680/30ml-20wt% fully dispersed in Propylene Glycol (PG) / 1, 2-Propanediol / Methylethylene glycol
$980/30ml-20wt% fully dispersed in Butyl Acetate

Please contact us for quotes on larger quantities.
Stock #: US2010
AlN nanoparticles nanopowder water ethanol acetone NMP Isopropanol dispersion

Aluminum Nitride Nanopowder (hexagonal) Purity: 99.5% (metal basis)
APS: 65-75 nm
Color: white to gray
Zeta potential: 44.7mV
Bulk density: 0.05g/cm3
Decomposed in water, UN 2813
AlN Nanopowder Manufacturing Method: High-Temperature Cumbustion Method

Certificate of Analysis-%:

N O C Fe Si Ca Cl V Fee N Free Al
>33 <0.8 <0.04 <0.01 <0.045 0.009 0.0004 0.025 1wt% 1wt%

Performance: 1. High purity, small particle size distribution, large specific surface area, high surface activity, low bulk density, good performance of injection molding; 2. For composite materials, and good match with the semiconductor silicon, interface compatibility, and can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.

Application:  Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing ( chucks, carriers)..

Storage Conditions: Damp reunion will affect its dispersion performance and using effects, therefore, this product should be sealed in vacuum and stored in cool and dry room and it should not be exposure to air. In addition, the product should be avoided under stress.

Aluminum Nitride Nanopowder / Nanoparticles: SDS

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