Solid Near Spherical Copper Cu Powder, 99.5%
Details:
Powder Features: Making method: High pressure steam water synthesis; particle size measured by sieve filtration method-all pass, For example, 75um size Ni, all particles must pass through 75um sieve net. That is, 100% particles <75um.
$75/100g - 150um - spherical
$388/1kg - 150um - spherical
$75/100g - 100um - spherical
$388/1kg - 100um - spherical
$75/100g - 75um - spherical
$388/1kg - 75um - spherical
$75/100g - 45um - spherical
$388/1kg - 45um - spherical
$75/100g - 20um - spherical
$388/1kg - 20um - spherical
$75/100g - 8um - Near spherical
$388/1kg - 8um - Near spherical
$75/100g - 5um - Near spherical
$388/1kg - 5um - Near spherical
$75/100g - 1um - Near spherical
$468/1kg - 1um - Near spherical
$45/25g - 500nm - Near spherical
$85/100g - 500nm - Near spherical
$295/500g - 500nm - Near spherical
$498/1000g - 500nm -Near spherical
$45/25g - 300nm - Near spherical
$85/100g - 300nm - Near spherical
$295/500g - 300nm - Near spherical
$498/1000g - 300nm - Near spherical
Stock# US5002
Powder Features: Making method: High pressure steam water synthesis; particle size measured by sieve filtration method-all pass, For example, 75um size Ni, all particles must pass through 75um sieve net. That is, 100% particles <75um.
Copper (Cu) Powder Certificate of Analysis-%-Metal Basis
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Cu
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As
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Sb
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Pb
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Sn
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Fe
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Ni
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Bi
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O
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99.5
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≤0.002
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≤0.002
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≤0.001
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≤0.05
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≤0.05
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≤0.05
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≤0.05
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1.76
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Copper (Cu) Powder / Nanopowder Applications:
The superficial conductive coating processing of metal and non-ferrous metal; Medicine append material; Capacitor materials; Raw material for bulk nanomaterial: Adopt the inert gas to make bulk copper composite material with powder metallurgy; Cu Powder / Nanoparticles widelly used as Catalysts; Efficacious catalyst: Copper and copper alloy nanometer / powder, feature high efficacy and selectivity, can be used as catalyst in some reactions, e.g. carbon dioxide compound hydrogen to produce methanol; Cu Nanoparticles / Powder used as Conductive coatings; Conductive inks; Conductive slurry: The copper nanopowder / powder can be applied to the productiion of MLCC internal electrode and other electronic components in electronic slurry for the miniaturization of microelectronic devices; The electronic size with good performance made of copper nanopowder / powder instead of valuable metal particles cuts cost to a large extent; This technology is used to the preference of microelectronic processes; Conductive pastes; Cu Nanoparticles / Powder are high thermal conductivity materials; Lubricant additives: Adding 0.1~0.6% of copper nanopowder to lubricant oil and lubricant grease. It will form a self-lubricating and self-repairing coating film in the frictioning surface and lower its anti-friction and anti-wear performance; Cu Nanoparticles / powder Lubricant additives; Cu Nanoparticles Sintering additives, Cu Nanoparticles / Powder can be used as 3D printing material ….
Copper (Cu) Nanoparticles / Powder Storage Conditions:
Damp reunion will affect its dispersion performance and using effects, therefore, this product should be sealed in vacuum and stored in cool and dry room and it should not be exposure to air. In addition, the Copper (Cu) Nanoparticles should be avoided under stress.
Solid Spherical Copper Cu Powder SDS
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